Modern TQM System Features



In electronic devices, printed circuit boards, or PCBs, are utilized to mechanically support electronic parts which have their connection leads soldered onto copper pads in surface area mount applications or through rilled holes in the board and copper pads for soldering the component leads in thru-hole applications. A board design might have all thru-hole components on the leading or part side, a mix of thru-hole and surface mount on the top side just, a mix of thru-hole and surface install parts on the top and surface area mount components on the bottom or circuit side, or surface area install parts on the top and bottom sides of the board.

The boards are also used to electrically connect the needed leads for each component using conductive copper traces. The component pads and connection traces are engraved from copper sheets laminated onto a non-conductive substrate. Printed circuit boards are created as single agreed copper pads and traces on one side of the board only, double agreed copper pads and traces on the top and bottom sides of the board, or multilayer styles with copper pads and traces on top and bottom of board with a variable variety of internal copper layers with traces and connections.

Single or double sided boards include a core dielectric material, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is engraved away to form the actual copper pads and connection traces on the board surfaces as part of the board manufacturing process. A multilayer board includes a number of layers of dielectric product that has been fertilized with adhesives, and these layers are used to separate the layers of copper plating. All these layers are lined up and then bonded into a single board structure under heat and pressure. Multilayer boards with 48 or more layers can be produced with today's innovations.

In a normal four layer board style, the internal layers are frequently utilized to offer power and ground connections, such as a +5 V airplane layer and a Ground airplane layer as the 2 internal layers, with all other circuit and component connections made on the top and bottom layers of the board. Very intricate board designs might have a large number of layers to make the different connections for different voltage levels, ground connections, or for linking the numerous leads on ball grid range gadgets and other big integrated circuit bundle formats.

There are typically two types of material used to build a multilayer board. Pre-preg product is thin layers of fiberglass pre-impregnated with an adhesive, and is in sheet type, usually about.002 inches thick. Core product is similar to a really thin double sided board because it has a dielectric material, such as epoxy fiberglass, with a copper layer transferred on each side, generally.030 thickness dielectric material with 1 ounce copper layer on each side. In a multilayer board style, there are two methods used to build up the wanted variety of layers. The core stack-up technique, which is an older technology, utilizes a center layer of pre-preg product with a layer of core material above and another layer of core product listed below. This combination of one pre-preg layer and 2 core layers would make a 4 layer board.

The movie stack-up approach, a newer technology, would have core material as the center layer followed by layers of pre-preg and copper product developed above and listed below to form the final variety of layers needed by the board design, sort of like Dagwood developing a sandwich. This method enables the maker flexibility in how the board layer densities are combined to satisfy the ended up product thickness requirements by differing the number of sheets of pre-preg in each layer. As soon as the product layers are finished, the entire stack undergoes heat and pressure that triggers the adhesive in the pre-preg to bond the core and pre-preg layers together into a single entity.

The procedure of producing printed circuit boards follows the steps listed below for a lot of applications.

The process of determining products, processes, and requirements to fulfill the client's specifications for the board style based on the Gerber file info offered with the purchase order.

The procedure of moving the Gerber file information for a layer onto an etch withstand film that is placed on the conductive copper layer.

The traditional procedure of exposing the copper and other locations unprotected by the etch withstand movie to a chemical that gets rid of the unguarded copper, leaving the safeguarded copper pads and traces in location; newer procedures use plasma/laser etching rather of chemicals to eliminate the copper material, permitting finer line meanings.

The process of lining up the conductive copper and insulating dielectric layers and pressing them under heat to trigger the adhesive in the dielectric layers to form a solid board product.

The process of drilling all of the holes for plated through applications; a 2nd drilling process is used for holes that are not to be plated through. Information on hole location and size is included in the drill drawing file.

The process of applying copper plating to the pads, traces, and drilled through holes that are to be plated through; boards are placed in an electrically charged bath of copper.

This is needed when holes are to be drilled through a copper area however the hole is not to be plated through. Avoid this process if possible due to the fact that it adds expense to the ended up board.

The procedure of using a protective masking product, a solder mask, over the bare copper traces or over the copper that has actually had a thin layer of solder applied; the solder mask protects versus ecological damage, provides insulation, protects against solder shorts, and secures traces that run between pads.

The process of finish the pad locations with a thin layer of solder to prepare the board for the eventual wave soldering or reflow soldering process that will take place at a later date after the parts have actually been positioned.

The procedure of applying the markings for blog part designations and element lays out to the board. May be used to just the top or to both sides if parts are mounted on both top and bottom sides.

The process of separating multiple boards from a panel of identical boards; this procedure also permits cutting notches or slots into the board if needed.

A visual examination of the boards; likewise can be the procedure of inspecting wall quality for plated through holes in multi-layer boards by cross-sectioning or other techniques.

The procedure of checking for continuity or shorted connections on the boards by means using a voltage in between different points on the board and determining if a present circulation takes place. Relying on the board intricacy, this procedure might need a specially designed test fixture and test program to incorporate with the electrical test system used by the board producer.